Development Engineer and Project Lead PowerGaN Metallization (f/m/div)

Join an international development team and help shape the future of power electronics with GaN-based power semiconductor technologies. In this role, you will combine technical innovation with project leadership responsibilities, driving advanced metallization solutions from the initial process concept through to successful implementation in manufacturing.

Your role

Key responsibilities in your new role

• Develop 300 mm front-end Cu metallization and pad technologies for GaN-based power semiconductor applications, from process concept to transfer into production
• Take on project leadership responsibilities for BEOL technology development activities in Dresden and support ambitious project plans to accelerate time-to-market
• Drive the development and implementation of metallization concepts with a focus on stability, yield, reliability, and manufacturing costs
• Collaborate closely with process development engineers to define, implement, and optimize process requirements
• Work in multinational and cross-site development teams, with project management based in Villach, Austria, and team leadership in Regensburg, Germany

Your profile

Qualifications and skills to help you succeed

• A university degree in Microsystems Engineering, Electrical Engineering, Physics, or a related scientific or engineering discipline
• At least 5 years of relevant experience in process technology development and/or process integration, ideally within semiconductor metallization
• Proven skills in technical leadership and project management
• A high level of initiative, ownership, and motivation
• Strong communication and collaboration skills in international environments
• Fluency in both German and English, with the ability to communicate and present effectively in both languages