Project Manager Package Development DSO

To plan, manage and drive timely completion of projects including new package & product derivates ramp up, in order to ensure success in meeting project deliverable in time, scope and budgets

Your Role

Key responsibilities in your new role

• To plan, manage and drive timely completion of projects including new package & product derivates ramp up, in order to ensure success in meeting project deliverable in time, scope and budgets
• Responsible for the project’s success (scope, budget, time, quality, delivery)
• To drive and manage project business case
• To setup appropriate project team structure
• define target and deliverables for the projects and all related sub-projects (if applicable)
• Plan and execute mitigating measures with respect to identified/potential project risks

Your Profile

Qualifications and skills to help you succeed

• Bachelor or Master’s Degree in Mechanical, Electrical or Electronics Engineering, Material Science, Metallurgical Engineering or a related discipline
• At least 10 years of working experience in semiconductor assembly and packaging development and experience in Project Management(preferably in the field of semiconductor industry, BE Assembly/Test)
• Knowledge in semiconductor BE assembly / test industry
• Fundamental knowledge in Project Management (planning, risk management, consolidation, negotiation)
• Knowledge in technical and cost interrelations/ correlations
• Presentation and document compilation skills
• Negotiation skills and strategic thinking
• Competent in daily oral & written English for cross-functional and overseas communication

Contact: minfang.zhou@infineon.cn, LinkedIn

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