University Professorship (W3) “AI Methods in Chip Design”

Deine Aufgaben

• You will conduct research on AI-based design and deployment methods for modern chip design.
• You will conduct research on modern computer architectures, such as AI accelerators, in-memory computing, non-von Neumann architectures, and neuromorphic computing.
• You will design ASICs for AI applications in edge computing, smart sensors, intelligent robots, as well as for medical and automotive technology.
• You will network with researchers in related fields at connAIx in Heilbronn, as well as at KIT and the Universities of Stuttgart and Tübingen, and strive for close collaboration with the Fraunhofer IAF in Heilbronn.
• You will actively shape the qualification program for more than 60 doctoral researchers at connAIx.
• You actively participate in teaching in the degree program Chip Design and other degree programs offered by the KIT Department of Electrical Engineering and Information Technology (ETIT).
• You will participate in the organization and management of connAIx and the department committees, as well as in the department tasks of the KIT Department of Electrical Engineering and Information Technology (ETIT).
• You will provide active and innovative impetus for academia and industry, particularly through project initiatives, patents, and spin-offs.
• You will execute university tasks with a teaching obligation of 9 hours per week per semester. It is planned to reduce the teaching obligation.

The University Professorship is based at connAIx in Heilbronn and is affiliated with the KIT Department of Electrical Engineering and Information Technology (ETIT). Strategically, the University Professorship makes a key contribution to Germany’s High-Tech Agenda by further developing methods of electronic design automation (EDA) using AI - for example, in layout generation or the extraction of electrical models - as well as researching new AI circuit architectures, such as neuromorphic, high-performance, and reliable computing structures in sensor technology, edge computing for future applications in fields such as medical and automotive technology.

Dein Profil

• You hold a doctoral degree with above-average grades in electrical engineering and information technology or a related field.
• You have a track record of outstanding, internationally recognized research achievements in the field of “AI Methods in Chip Design.”
• You have relevant experience across the entire microchip development chain, from design through tape-out to electrical testing.
• You possess excellent teaching skills (in English and, in the future, in German) and the ability to secure your own external funding.
• You have strong skills in leading and organizing a research group.

Employment is subject to Art. 14, par. (2) of the KIT Act in conjunction with Art. 47 LHG Baden-Württemberg (Act of Baden-Württemberg on Universities and Colleges).

Vergütung & Benefits

Salary is governed by the statutory provisions of the State of Baden-Württemberg and comprises the basic salary of salary grade W3.

In addition, the granting of performance-related pay components is possible. The family allowance is paid, where applicable, in accordance with civil service law.

Vergütung: 1 bis 2 EUR brutto pro Jahr

• Exzellente Forschungsbedingungen & modernste Infrastruktur: Profitieren Sie von einem einzigartigen Umfeld, das Universität und Großforschung verbindet, und erhalten Zugang zu hochmoderner Ausstattung und interdisziplinären Projekten. Dieses Umfeld ermöglicht Ihnen sowohl Grundlagenforschung als auch anwendungsorientierte Forschung auf höchstem Niveau.
• Internationale Vernetzung: Sie arbeiten in einem globalen Netzwerk, das internationale Kooperationen und englischsprachige wissenschaftliche Kommunikation umfasst. Das KIT fördert den Austausch mit führenden Forschungseinrichtungen und Industriepartnern weltweit.
• Transparente Karrierewege & persönliche Weiterentwicklung: Klare Entwicklungsperspektiven, individuelle Coachings und ein ausgereiftes Führungskräfteentwicklungsprogramm unterstützen Sie dabei, Ihre akademische Laufbahn gezielt zu steuern.
• Familienfreundliche Angebote: Der Dual‑Career‑Service des KIT unterstützt Sie und Ihre Partnerin bzw. Ihren Partner bei der beruflichen Integration, während flexible Arbeitszeitmodelle und betriebliche Kinderbetreuung die Vereinbarkeit von Beruf und Familie erleichtern.
• Onboarding & Integration: Ein maßgeschneidertes Onboarding Programm begleitet Sie vom ersten Arbeitstag an, sodass Sie schnell in Forschung, Lehre und die Netzwerke des KIT einsteigen und optimal starten können.

Über den Arbeitgeber

connAIx is a new, joint research institute for applied AI established by three leading universities - KIT, the University of Stuttgart, and the University of Tübingen - that focuses on AI research in the fields of chip design, robotics, and related topics for AI applications. Located in the Heilbronn, it offers extensive opportunities for collaboration with industry partners and other research institutions, including imec, Fraunhofer, ETH Zurich, and the Technical University of Munich. Based on this, the Chair of AI Methods in Chip Design is being established at KIT. The chair addresses the research field of AI methods for circuit design and the development of new AI circuit architectures.

Bewerbungsprozess

For subject-matter inquiries, please contact Prof. Dr.-Ing. Dr. h.c. Jürgen Becker, Email:juergen.becker@kit.edu

Please send your detailed application in English with the relevant documents (curriculum vitae, a list of up to ten of your most important publications, acquired third-party funding or responsibilities in industry, diplomas / certificates, teaching evaluations, description of previous and planned research and teaching activities in the above-mentioned fields) to Karlsruhe Institute of Technology (KIT), Division III - Mechanical and Electrical Engineering, Head of Division Prof. Dr. Marcel Utz, Kaiserstr. 12, 76131 Karlsruhe, preferably in the form of a single PDF file to: berufungen@BL3.kit.edu

Bewerbung und Rückfragen per E-Mail: julia.boldt@partner.kit.edu